CAS 670-96-2 2-Phenylimidazole Epoxy Resin Curing Agent

As an imidazole-based curing agent, it undergoes a ring-opening reaction with the epoxy groups of epoxy resin through the active sites on its imidazole ring, promoting the cross-linking of the resin to form a three-dimensional network structure. Typical curing conditions are as follows:

Recommended Addition Amount: 2%-5% of the mass of epoxy resin (adjustable according to the resin type).

Curing Temperature: Medium-temperature curing (80-120℃) with a full curing time of 2-4 hours; slow curing can be achieved at room temperature (requiring 24-48 hours).

Applicable Resin Types: General-purpose epoxy resins such as bisphenol A type and bisphenol F type, with good compatibility with alicyclic epoxy resins.

Mechanical Strength: Tensile strength ≥ 60 MPa, flexural strength ≥ 90 MPa (when used with E-51 resin).

Thermal Stability: Heat distortion temperature (HDT) ≥ 120℃, with short-term temperature resistance up to 150℃.

Electrical Properties: Volume resistivity ≥ 1×10¹⁴ Ω·cm, dielectric strength ≥ 20 kV/mm.

Chemical Resistance: Good resistance to media such as water, ethanol, and dilute acids